Kyocera to build two new plants for ceramic components supporting IoT and 5G

Kyoto/London − Kyocera announced that it will construct two additional production facilities at its Kokubu Plant Campus in Kagoshima, Japan, to serve customers worldwide. The new facilities will double the campus’ production capacity for fine ceramic components used in semiconductor manufacturing equipment, while securing space for other manufacturing as Kyocera’s business expands. A signing ceremony held on October 20, 2021 included Kagoshima Governor Koichi Shiota, Kirishima City Mayor Shinichi Nakashige, and Kyocera officials. Construction is scheduled to begin in November 2021.

The growth of Internet of Things (IoT) and 5G telecommunications services is fueling demand for semiconductors used in nearly everything from personal computers, smartphones, and data centers to automobiles. To respond to this acceleration in the semiconductor market, Kyocera is increasing production of high-demand fine ceramic components used in semiconductor manufacturing equipment. The company plans to begin production of fine ceramic components at the new No.7-1 plant in October 2022, and at the No.7-2 plant in October 2023.

Kyocera expects its fine ceramic business expansion to stimulate economic development in Kagoshima Prefecture and create new employment opportunities in the community.

Outline of New Facilities

Name	Plants No.7-1 & 7-2 at Kyocera’s Kagoshima Kokubu Plant Campus
Address	1002-1 Kokubukamikogawa, Kirishima-shi, Kagoshima Prefecture, Japan
Total investment	Approximately 11 billion yen (approx. 97 million U.S. dollars)
Building footprint	No.7-1: 5,174 m2　(55,692 f2), steel construction, 2 stories No.7-2: 6,996 m2　(75,304 f2), steel construction, 6 stories
Total area	No.7-1: 10,120 m2 (108,931 f2) ／ No.7-2： 37,497 m2 (403,614 f2)
Construction plan	No.7-1: Construction to begin November 2021 Facility to open October 2022 No.7-2: Construction to begin November 2021 Facility to open October 2023
Production items	Fine ceramic components for semiconductor manufacturing equipment used in IoT, 5G telecommunications and other applications
Expected production level	Approximately 3.4 billion yen (approx. 30 million U.S. dollars) per year (April 2023-March 2024）